Electronics Manufacturing
Testing and validation
Functional, environmental, AOI and in-circuit testing
Every product we manufacture undergoes rigorous testing and validation, including functional testing, environmental stress screening (ESS), automated optical inspection (AOI), in-circuit testing (ICT) and reliability analysis to ensure zero-defect delivery.
PCB assembly tests include:
- SPI (solder paste inspection): after solder paste is printed and before SMDs are placed, the SPI machine checks the paste’s shape, size, thickness and position.
- X-ray inspection: boards with BGAs are X-rayed to check the connections between the PCB and the BGA.
- AOI (automatic optical inspection): after reflow soldering, AOI identifies defects such as solder bridges, voids and tombstones.
- Visual inspection: QC members inspect the PCBAs before re-soldering and after wave soldering.
- Application simulation test: the PCBA is installed as a package and run in its working environment for a long time to check its functions.